Solder Paste Flux No Clean Welding Repair Electronic Material
Solder Paste Flux No Clean Welding Repair Electronic Material
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90-Day Risk-Free Return
90-Day Risk-Free Return
We’re sure you’ll love your order! But if for any reason you’re not completely happy, you can return it within 90 days for a full refund. It’s 100% risk-free.
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Shipping & Tracking
Shipping & Tracking
Orders are typically processed within 2–4 business days after payment. Please note that processing may take a little longer during peak seasons or special promotions.
Once your order has shipped, you’ll receive an email with tracking details so you can easily follow its journey.
Every person that solders should have some it this in their kit
SMART DESIGN
New technical support, the unique chemical formula provides excellent wetting, to ensure high reliability. Adapted to the mobile phone repair industry, computer digital service industries, and high-precision circuit board soldering SMT/BGA soldering processes.
PCB/BGA DEDICATED
High-end quality, a unique formula, perfect performance, easy to weld, solder joint is bright and full, no weld, false welding phenomenon.
WIDELY APPLICABLE
The residue is colorless and transparent, does not affect the detection, disposable and excellent cleaning performance. Use of efficient energy thixotropic agents, printing and preheating collapse, special solder ensure a good printing and fine pattern.
REVOLUTIONARY DURABILITY
Wetting, anti-dry, relatively long shelf life at room temperature. Unique high-quality solder paste, fine and flexible packaging (10 cc/support), delicate appearance.
What is the solder tin paste?
- Solder tin paste is a new type of solder material that comes with SMT.
- Solder paste is a complex system that is made of a paste of solder powder, flux, and other additives.
- At the normal temperature, the solder tin paste has a certain viscosity, and the electronic component can initially adhere to a predetermined position.
- At the soldering temperature, the soldered component and the printed circuit pad are soldered together(Permanent connection.) with the evaporation of the solvent and some additives.
Preservation method:
- The solder paste should be kept at 1-10℃.
- Before the opening, the temperature of the solder paste should be raised to the ambient temperature (25℃), and the temperature return time should be about 3-4 hours.
- The solder paste should be used for 6 months.
- The solder paste should not be placed in the sun.
Precautions:
- Use only with adequate ventilation.
- The solder paste contains an organic solvent. Avoid repeated contact with skin. If the solder paste gets on your skin, wipe it off with alcohol and rinse thoroughly with water.
- Avoid contacting with eyes.
- Keep away from children.
